13
July 2001 - NOVATEC Ball Placement technologies exhibited
at SEMICON WEST 2001 (SAN JOSE, July 16-20)
DEK
will be exhibiting ball placement and wafer bumping
applications using the ProFlow® DirEKt Imaging enabling
technology for screen printers at SEMICON West, Booth
14522 in the Parkside Hall of the San Jose Convention
Center. The combination of the patented ProFlow technology
with precision stencils and custom-designed wafer handling
equipment now delivers significant savings in capital
investment, process complexity and overall process footprint
compared to existing semiconductor packaging processes.
New levels of throughput, accuracy and repeatability
are founded on the patented, fully enclosed transfer
head.
Combined with precision stencils and custom-designed
wafer handling equipment, stencil printing with ProFlow
offers huge savings in capital investment, process complexity
and overall process footprint. DEK has recently demonstrated
solder ball placement solutions compatible with the
0.3mm spheres suitable for WL-CSP, enabled by ProFlow
technology, and capable of accurate and repeatable placement
on wafers and ceramics, as well as FR4 substrates in
strips, boats and carriers. Wafer level processing has
been proven to offer significant cost advantages but
is not well supported by traditional equipment and processes.
|
