24
July 2001 - MPM Puts the Squeeze on Paste Dispensing Market
Enhanced Performance,
Cost Reduction, Better Paste Management; Hallmarks of New
Rheometric Pump Print Head from Speedline
FRANKLIN,
MA - Electronic assembly manufacturers no longer have to confront
the problem of solder paste waste with printing systems that
are unable to control solder paste consistency, pressure and
volume. Instead of rolling paste onto an open-air stencil,
MPM's new Rheometric Pump Print Head contains the entire paste
roll inside a sealed head.
Speedline's
Rheometric Pump is based on proven MPM Balanced Control Print
Head Technology that allows the entire dispensing assembly
to float on the stencil. As the pump head moves across the
stencil, the combination of pneumatic pressure and friction
between the paste and the stencil causes the paste to continuously
roll inside the chamber. This ensures a consistent seal with
the stencil. Using this new technology, manufacturers are
assured that the viscosity of the paste is maintained through
a unique circular chamber design that does not allow for dead
spots or exposure to the air.
"MPM
places a premium on practical innovation, the creative application
of advanced technologies and a logical path to process solutions,"
said Bob Balog, Vice President and General Manager of Speedline
MPM.
"MPM's
Rheometric Pump Head provides our customers with a complete
process solution that offers many advantages over traditional
squeegee blade applications, including consistency, control,
price and performance improvements through the product's ability
to reduce waste and cost."
The Rheometric
Pump Head accepts industry-standard paste cartridges and uses
a closed-loop, "vortex control" pressure feedback
system to ensure that the proper amount of paste is pumped
into the chamber. Using MPM's patented Balanced Control Print
Head and Tactile Sensor technology, the Rheometric Pump lightly
skims the stencil and adapts to the changing topography of
the board to ensure a consistent seal to the stencil surface.
Speedline
MPM's Rheometric Pump Head features a Vision 'On-the-Move'
Alignment that incorporates advanced vision algorithms
that quickly process fiducials 'On-the-Move' for efficient
image capture. MPM's patented "look up, look down"
illumination and optics technology provides advanced
closed-loop feedback. A balanced control print head
featuring frictionless electro-pneumatic controls, ensures
precise and repeatable squeegee movement. Left and right
pressures, print speed, blade attack angle and squeegee
downstop can all be independently adjusted between front
and rear squeegee blades. Also, a variable print direction
feature optimizes material deposition regardless of
X-Y pad orientation. This allows for rotation and printing
at 0º, 45º, or 90º. Finally, the fast-cycle
vacuum stencil cleaner from MPM provides automatic,
unassisted cleaning of the bottom-side of the stencil.
A lint-free paper wiper system removes material bleed-out,
while an independently programmable vacuum system removes
solder paste from stencil apertures eliminating "opens"
on the final assembly
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