Advanced
Packaging Award for Solder Bumping. NOVATEC's licensee : DEK
Printing Machine won the Advanced Packaging Award in the Solder
Bumping category.
The
DirEKt Ball Placement System TM was evaluated against other
entries on a 10-point scale for its innovation, cost-effectiveness,
speed/throughput, quality, ease-of-use, maintainability, and
environmental responsibility. The judges' panel comprised
ten independent industry experts from major universities,
consortiums and consultancies around the world.
The
Solder Bumping category of the Advanced Packaging awards covers
the processes and equipment that creates ball or bump interconnections
on chips or packages. DirEKt Ball Placement System combines
the patented ProFlow® DirEKt Imaging technology with precision
stencils and custom-designed solder ball hopper to deliver
significant savings in capital investment, process complexity
and overall process footprint compared to existing semiconductor
packaging processes.
The
ball placement solution actually consists of two machines,
DEK's ELA and 265 Horizon systems, side-by-side in the production
line. The first machine puts down flux or solder paste using
print technology. The second machine features a ball transfer
head that positions a solder ball at each pad location. The
balls are gently, but firmly, pushed down into the receiving
material with independent pressure on each sphere.
Wafers
can be processed using dedicated tooling. Other substrates
can be processed in strips, trays or boards, making the equipment
highly flexible to process needs. The ball placement reservoir
is easily interchanged in situ, and the 2-stage hopper design
holds up to 50 million solder balls. Product changeover is
under 10 minutes. |
