02
May 2002 - NOVATEC's Ball placement technology is 300 mm ready.
DEK
has successfully deployed a production wafer bumping solution
for 30Omm wafers at a customer site in Asia. The system has
been developed using DEK's mass imaging technology for back
end wafer processing. The wafer handling technology developed
by Adept Semiconductor Equipment Division of Livermore, California
in conjunction with DEK.
The new system
builds on DEK's existing back end solutions for 15Omm and
20Omm wafers, and is capable of transferring 30Omm wafers
from open cassettes or FOUP's into the processing station,
and of automatically returning them to the cassette or FOU
P when processing is complete. Wafers are transported by a
conveyor, which is integrated with the system via standard,
SMEMA-compliant interfaces. “This is a real, production
system that is in action today, processing customer’s
30Omm wafers and delivering excellent results," said
Neil MacRaild, manager of DEK's Advanced Technologies Group.
"This is important news as commercial electronic manufacturers
move toward volume production of high performance chip scale
packages."
DEK's back
end processing solutions for 15Omm and 20Omm wafers are already
in operation at customer sites throughout Europe, the USA
and Asia. These successful processes, including DirEKt Ball
AttachTM solder ball placement, and fine-pitch bumping by
paste deposition, are based on DEK's patented ProFlow ®
DirEKt lmaging technology that enables precision control of
electronic materials for deposition onto wafers and other
substrates such as FR4 epoxy. These include solder balls down
to 0.3mm, solder pastes including low-alpha pastes, encapsulants
and other materials required by advanced semiconductor packaging.
By reducing
the capital cost of clean room space of back end wafer level
processes, while enhancing equipment flexibility and first
pass yield, DEK's packaging technologies allow advanced wafer
level CSPs and other chip scale package styles to be applied
to a wide range of commercial component types. |
