Awards
Granted at APEX Recognize DEK for Service and Advanced Technology
DEK,
a global printing solutions provider, received broad industry
recognition for its leadership in both customer service and
innovative technology during the APEX exhibition held March
30-April 2 in Anaheim, California. DEK won both a Service
Excellence Award and a Vision Award, and provided the enabling
technology for an Excellence in Electronic Packaging and Production
Award won by W.L. Gore & Associates.
The Service
Excellence Award, sponsored by Circuits Assembly magazine,
recognizes suppliers who receive the highest customer service
rankings from their own customers. DEK won in the screen printing
category, based on how customers rated the company in five
categories: dependability, ease of use, responsiveness, technology
and value for price.
DEK also won
a Vision Award for innovative technology, sponsored by SMT
magazine, for DirEKt Ball Placement™, which provides
significant performance and cost advantages for semiconductor
packaging. DirEKt Ball Placement™ uses DEK's patented
ProFlow® DirEKt Imaging technology to place solder balls
as small as 0.3 mm in diameter onto substrates or wafers,
with fine-pitch accuracy and first-pass yields consistently
better than 99%. The screen printer platform that serves as
the foundation of the technology enhances productivity through
cost-effective flexibility as well as speed and accuracy.
DirEKt Ball
Placement™ also serves as the enabling installation
technology for snapSHOT™, a new board-level EMI shielding
solution from Gore, which won an Excellence in Electronic
Packaging and Production Award, sponsored by EP&P magazine.
Gore's lightweight, easily removable snapSHOT™ shield
provides wireless communications devices with excellent EMI
protection and overcomes the limitations of metal cans.
DEK and Gore
combined their expertise to develop a snapSHOT™ installation
process compatible with high-speed, high-volume SMT assembly.
The process uses DirEKt Ball Placement™ technology to
place solder spheres in precise patterns on a PCB. Gore's
patented snap-attach mechanism then secures the snapSHOT™
shield over the solder spheres which, when reflowed, provide
both electrical and mechanical connection. If needed, the
shield can be removed and replaced with a new one, without
de-soldering or re-soldering.
"It
is a significant honor for DEK to receive these industry
awards, which demonstrate that our expertise extends
beyond the delivery of outstanding equipment,"
said Richard Heimsch, President of DEK International.
"To be selected by our own customers for providing
the highest levels of service and support is most gratifying.
Additionally, the recognition of our ball placement
technology for enhancing productivity and cost-effectiveness
in semiconductor packaging, and for enabling production-level
implementation of an innovation developed by Gore, exemplifies
how DEK partners with customers and colleagues worldwide
to develop advanced pre-placement manufacturing solutions
that benefit the entire electronics industry."
DirEKt
Ball Placement™ is a NOVATEC technology.
This technology is exclusively licensed to DEK.
DirEKt
Ball Placement™ is a Trade Mark of DEK. |
