DEK
DirEKt Ball Placement Achieves Better Than 99% First-Pass
Yield for Semiconductor Packaging
A variety of advanced process technologies developed by DEK
offers significant performance and cost advantages for semiconductor
packaging. As the world's leading provider of advanced pre-placement
manufacturing solutions, DEK has focused its applications
expertise on achieving new levels of throughput, accuracy
and repeatability in wafer bumping, using a cost-effective
screen printing platform.
DEK's
semiconductor packaging technologies include DirEKt Ball Placement™,
a fully automated wafer handling solution and Virtual Panel
Tooling (VPT). These solutions may be incorporated in a production
line individually or in combination with each other to enhance
productivity in comparison with traditional approaches.
DirEKt
Ball Placement™ uses DEK's patented ProFlow® DirEKt
Imaging technology to place solder balls as small as 0.3 mm
in diameter onto substrates or wafers, with fine-pitch accuracy
and first-pass yields consistently better than 99%. The integrated
process begins with flux deposited at each interconnect site
using DEK's sophisticated flux imaging technology.
The
fully enclosed ProFlow® ball transfer head, which can
hold up to 50 million solder balls, guides each solder ball
directly to the surface of the stencil with minimum friction.
A controlled placement force seats each ball gently but firmly
in the flux, enhancing assembly integrity during downstream
handling and reflow. Cycle time is fast, consistent and independent
of I/O count. The excellent coplanarity that is achieved optimizes
electrical and mechanical performance. Tooling options allow
the system to accept singulated substrates, strips, panels
or boats.
DEK's
DirEKt Ball Placement™ may be integrated with a fully
automated wafer handling station. Developed in conjunction
with specialist partner Adept Semiconductor Equipment Division,
the station can accept 150, 200 and 300 mm wafers.
Each
wafer is unloaded automatically from the cassette onto the
wafer chuck. After solder ball placement or paste deposition,
the wafer may be returned to its original position in the
cassette or transferred directly to a reflow oven. The station
complies with SMEMA and SEMI S-2 industry standards.
With
Virtual Panel Tooling, dozens of substrates are aligned independently
and simultaneously to create a virtual panel that can be imaged
in a single cycle, creating multiple, highly accurate processed
substrates at high speed. VPT delivers high throughput comparable
to processing panelized substrates, with accuracy comparable
to individually aligned substrates. Typical applications include
solder paste printing, solder ball placement, epoxy printing
for die attach, and conductive adhesive deposition.
DEK's
advanced process technologies for semiconductor packaging
all overcome the limitations of high-cost dedicated
equipment. The screen printer platform that serves as
the foundation of the technologies can be reconfigured,
quickly and easily, for a wide variety of materials
deposition processes. The platform's adaptability to
changing production requirements enhances productivity
through cost-effective flexibility as well as speed
and accuracy. Visitors to APEX 03 can witness DEK's
semiconductor packaging technologies in action and discuss
their benefits with senior DEK representatives at Booth
#2225, March 31-April 2.
DirEKt
Ball Placement™ is a NOVATEC technology.
This technology is exclusively licensed to DEK.
DirEKt
Ball Placement™ is a Trade Mark of DEK.
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