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February
2004 - A licensee is sought for an original bumping
technology
February 2004, US Patent 6689412 has been granted to
NOVATEC for its in-situ bumping technology. That technology
opens new possibilities in terms of miniaturization
and cost reductions. NOVATEC's concept consists in producing
bumps onto substrates by reflowing solder paste. In
order to achieve the right bump dimension a mold mask
is left onto the substrate during the reflow cycle and
is removed as the melted metal is at a liquid stage.
Thanks to that process, it is possible to produce bumps
by reflow soldering in a very consistent manner and
at a very low cost. To industrialize that technology,
NOVATEC is looking for a partner who is willing to enter
that growing market.
For
more information contact Clement Kaiser at novatec@novatec-eap.com
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