28 May 2004 - Rohm and Haas Electronic Materials and Novatec sign an exclusive agreement for an innovative filling process and device

Rohm and Haas Electronic Materials, represented by Mr Patrice Barthelmes, President for Europe, and Mr Francis Bourrieres, CEO of Novatec, have signed an exclusive licensing agreement to make and sell an innovative filling process and device.

The invention has applications in the area of printed circuit board manufacturing such as those used in the automobile industry. It revolutionises all the market’s current techniques by eliminating previous problems associated to filling hollows or inter-conductor areas with dielectric on a printed circuit board. In addition, the filling time with this innovative device is four times faster than current methods.

The use of filling process and the unique features of the device will help to achieve optimised filling applications and optimum circuit board features.

Rohm and Haas are specialists for process and solutions in the area of electronics. Novatec is a research lab focusing on the assembling industry. They are joining their expertise in this exclusive agreement for the fabrication of an innovative serigraphy device that will be marketed in late 2004 and a deposition process called Durashield V42 Filler that is already available on the market.

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