January 2007
The VacuNest family expands with the Tabletop version |
5 April 2006
Award at the Electronics Manufacturing Asia Innovation Awards 2006 |
April 2006
Vacunest gets large customer acceptance |
February 2006
Novatec Exhibits VacuNest Shape Memory Tooling at SMT/Hybrid/Packaging 2006 |
February 2006
Novatec Appoints Head-Tech Engineering as Israel Distributor for VacuNest |
February 2006
Novatec appoints Matronic Oy as Finland Distributor for VacuNest |
February 2006
Novatec names Hawker Richardson as Australian and New Zealand Distributor for VacuNest |
February 2006
Novatec Highlights VacuNest Shape Memory Tooling at APEX 2006 |
December 12, 2005
Novatec Appoints SMT Kompetenz as German Distributor for VacuNest |
December 12, 2005
Novatec Appoints Process Support Products as U.K. Distributor for VacuNest |
15/18 November 2005
See the shape of the future with VacuNest at Productronica. |
17
February 2005
NOVATEC
introduces a new flexible board support system, with
shape memory, called VacuNest. |
February
2004
New
US patent 6689412 granted.
A
licensee is sought for an original bumping technology. |
9th
September 2003
Sanmina-SCI
confirms ProFlow paste wastage reductions |
| 12th
August 2003
The
DirEKt Ball Placement patent is granted in the United
States under the patent No: US 6,604,673 B1 |
1st
August 2003
Meco
Equipment Engineers BV has taken an enclosed head printing
(Proflow) license. |
8th July 2003
The
capillary Squeegee patent is granted in the United States
under the patent No: US 6,588,335 |
| 27th
May 2003
DEK
DirEKt Ball Placement Achieves Better Than 99% First-Pass
Yield for Semiconductor Packaging |
| 15th
April 2003
Prooftag
wins the Bronze Award at the " Siemens Innovation
Grand Prix 2003" |
| April
2003
DEK
and Gore Introduce snapSHOT™ Board-Level EMI Shielding
Solution. |
| 14th
April 2003
Awards
Granted at APEX Recognize DEK for Service and Advanced
Technology |
| 30
July 2002
NOVATEC's
enclosed print head unanimoulsy accepted |
| May
02, 2002
NOVATEC's
Ball placement technology is 300 mm ready.
DEK delivers first production mass imaging technology
for 300 mm wafers |
| 08
October 2001
Enclosed
head printing gains support worldwide |
| July
24, 2001
NOVATEC's
Ball placement technology rewarded at SEMICON WEST 2001 |
| July
24,2001
NOVATEC's
direct transfer technology becomes a standard in the
electronic industry |
| July
13, 2001
NOVATEC
Ball Placement technologies exhibited at SEMICON WEST
2001 (SAN JOSE, July 16-20) |
| May
16, 2001
Adhesive printing with plastic stencils : NOVATEC appoints
DEK as sole licensee |
| May
10, 2000
SEMICON WEST SAN-JOSE.
The
direct Ball attach NOVATEC patent application is launched
and the first machines are sold by DEK Printing Machines |
