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It consists
in placing the SMD components and the interconnection spheres
or preforms on the same substrate side. The spheres are made
in an high temperature alloy and are presenting a diameter
which is slightly higher than the component heights. The spheres
in addition to there interconnection function, have also an
interposer function to compensate the thermal mismatch between
the substrate and the printed circuit board and a spacer function
to allow the placement of the SMD components.
Thanks to
that process, NOVATEC introduces a new low cost multi-component
module concept called DBIC which opens new opportunities in
terms of design and miniaturisation. |
