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Larger
substrates, up to 500mm x 400mm, can be processed using DirEKt
Ball Placement, compared with traditional ball placement techniques.
The ball reservoir is easily interchanged in situ, and the
2-stage hopper design holds up to 50 million solder balls
to extend intervals between assists. Product changeover time
is under 10 minutes.
Handling
of solder balls is greatly improved over conventional techniques.
DirEKt
Ball Attach gently feeds the spheres to the surface of the
stencil, preventing knocking an excessive friction inherent
in gravity placement methods. Solder balls are transferred
to the grid array in perfect condition. The transfer force
exerted during placement is sufficient to push the ball down
into the flux at each pad location, to enhance the integrity
of the assembly during downstream handling and reflow soldering.
Flux
deposition is also enhanced ; DEK is the world leader in materials
transfer technology for the electronics industry, supplying
high performance systems for printing solder paste, flux,
adhesive, polymers and alloys to the world's most influential
equipment manufacturers.
DEK
now brings flux deposition in component packaging to new levels
of accuracy, repeatability and throughput. |
