Novatec - Electronic Assembly Process    

Surface Mount Solder Ball Assembly

    
 

Novatec Electronic Assembly Process - Indirect Ball Attach


Recently, NOVATEC has reached an agreement with EUROPLACER to industrialize and market that technology on a worldwide basis.


Contact us for further informations.


Home
Company
Technologies
News
 
DBIC
DirEKt Ball Placement™
Durashield Filler Coater
Hole Filling
Liquid Printing
ProFlex™
ProFlow®
Prooftag™
Spider Printer™
VacuNest

Varidot®
Surface Mount Solder Ball Assembly 
Copyright © 2005 Novatec SA | Support: novatec@ novatec-eap.com
Home | Company | Technologies | News