Novatec - Electronic Assembly Process    

ProFlow® DirEKt Imaging

   
 

DirEKt TRANSFER : A NEW CONCEPT

DirEKt transfer is a new concept which allows moving the product from its conditioning container to its deposit zone directly with no intermediate preparation operation.

That process calls for a totally enclosed transfer head to inject the product directly through the stencil apertures.

It replaces the printing process and removes the squeegee notion which pushes a roll of product to be transferred.


That innovation obtained 3 Awards:

one in SINGAPOUR 1998

Category Winner Award and Grand Award at NEPCON Los Angeles in 1998

Novatec Electronic Assembly Process - Proflow

PRINTING WITH PROFLOW

Our knowledge of the product characteristics and the consistency of the machine parameters lead to consistent and controlled results.

The contact time is known and constant, the rheology of the product to be transferred in the enclosed head is known and constant, the transfer force given by the piston is known and constant.


PROFLOW : PRINT QUALITY

The print speed is 3 times higher than with a traditional squeegee for a 0.4 millimetre pitch and the cleaning frequency divided by 10 for a 0.3 millimetre pitch shows at which point the quality remains optimum even with a significant throughput increase.

A test on a real production run to compare the cycle times between the two systems shows that 266 printed circuit boards per hour were produced with PROFLOW against 125 with the traditional method.


That process widens the process window dramatically. It can be noticed that parameter combinations between pressure and speed varying in an order of magnitude from 1 to 3 does not affect the quality of the result.

Trials to compare the volume transferred depending on the pad orientation have been conducted on 375 prints. They show consistent results from the beginning to the end of the test run.


PROCESS ADVANTAGES

The key points of the process are :
its stability, its repeatability (up to 60% less defects), the process window increase,
the decoupling between the printing operation and the other operations in the assembly line, the costs reduction (till 30 % less paste consumption), the throughput increase (cycle time divided per 2 )

Novatec Electronic Assembly Process - Proflow


In conclusion, the direct transfer process brings real significant improvements:

  • A key process in the printed circuit board production is controlled.
  • The solder paste consumption is reduced by 30%.
  • The process opens new horizons towards miniaturization.

Direct transfer becomes an industrial standard, Over thousand users in the world are currently using that technology through a master licensee:

DEK Printing Machine (Proflow)

and its sub-licensees :

SEMCO (PPG Industries)
Kyushu Matsushita Electric Co.
Meco Equipment Engineers BV
MPM (Speedline Technologies, Inc)
Hitachi High-Tech Instrument Co.
PastePuck Ltd
Svecia Engineering AB
Yamaha Motor Co.
EKRA

 

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