Novatec Electronic Assembly Process


*NOVATEC TECHNOLOGIES*

NOVATEC developments cover a very broad spectrum of the electronic industry. Our patented applications are in the following areas:

Pasty products printing

Liquid products printing

Selective printing

PCB reworking

BGA's and CSP's balling

Solder paste reflowing

Electronic assembly processes

	ProFlex Stencil technology to improve solder paste release.	Vacunest flexible board support system, with shape memory.

	Varidot® Chip bonding printing stencils.	Durashield Filler Thick copper intertracks filling technology
Patent EP770006 - US6183839 - FR2765813

	ProFlow® Solderpaste printing technology.	DBIC Daughter Board with Integrated Connector
Patent US6495199 - US6171399		Patent EP1155603 - FR2789541

	DirEKt Ball Placement	Spider Printer™ Selective printer.
Patent FR2798309		Patent FR2771674 - US6450091 - EP1015247

	Surface Mount Solder Ball Assembly	Prooftag™ Universal security marker.
Patent US6533160

	Liquid Printing An evolution of the ProFlow to print liquids	Hole Filling
Patent FR2782945		Patent FR2803227